Jacksonville Public Library

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Type

http://bibfra.me/vocab/lite/Meeting

Label

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Name

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Actions

Incoming Resources

Contributor of
1
- Mechanical characterization study of sintered silver pastes bonded in a double-lap configuration, Paul Paret [and five others]
Focus of
1
- ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems