Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches, Ryan Knight and Evan Cheng
Label
Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches, Ryan Knight and Evan Cheng
Note
Title from title screen (viewed Sept. 29, 2015)"September 2014."
Color
multicolored
Form Of Item
online
resource.govDocClassificationNumber
D 101.133:7094
resource.gpoItemNumber
0324-A-01 (online)
Physical Description
1 online resource (v, 29 pages), color illustrations.
Specific Material Designation
remote
resource.typeOfReport
Final.
Access location
Carrier category
Media category
Incoming Resources
- Item of1
Outgoing Resources
- Instantiates1
- Access location2
- Carrier category1
- Media category1
- Publication1