Flip chip hybridization using indium bump technology at ARL, Kimberley A. Olver
Label
Flip chip hybridization using indium bump technology at ARL, Kimberley A. Olver
Note
Title from title screen (viewed on Aug. 4, 2015)"July 2007.""ARL-TN-283."
Color
multicolored
Form Of Item
online
resource.govDocClassificationNumber
D 101.133/2:283
resource.gpoItemNumber
0324-A-03 (online)
Physical Description
1 online resource (iv, 8 pages), color illustrations
Specific Material Designation
remote
resource.strn
ARL-TN-283
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Carrier category
Media category
Publication
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